Electronics & Telecommunication

Hydrogen peroxide is used as photo resistant removal, wet cleaning and copper etchant in semiconductors, circuit boards, display and LED applications for analog, digital and electricity devices and memory products. Persulfates are used for the cleaning and micro etching of PCBs and as oxidizing agents in plating and coating processes.

Our solutions for the electronics industry range from thermal management additives that enhance the performance of electronic applications to specialty additives improving polymer electronic performance, flame retardancy and heat transfer in electronic applications.

Substituted cyclohexanones are important intermediates for LCDs and can be synthesized by hydrogenation of phenol. Our palladium-on-carbon catalysts enable this reaction in a highly selective process. Our catalysts are characterized by the high purity of the noble metals and excellent batch-to-batch consistency. The closed loop service we offer for precious metal recovery makes them both sustainable and cost efficient. 

For the production of high-performance composites, adhesives and moldings.

DYNASYLAN® silanes act as adhesion promoters and coupling agent for highly filled compounds and grafting & crosslinking additives for grafted polyethylene (PEg) resulting in PEX pipes or XLPE cables. They allow for high filler-loading levels in halogen-free flame retardant (HFFR) compounds with good melt processability and improved physical properties.

Ethyl silicate, the common name for tetra ethyl ortho silicate (TEOS), can be vaporized and thermally decomposed upon the surfaces of semiconductor chips. It forms electrically insulating layers of silica glass which are necessary in the fabrication of integrated circuits.

Adhesion promoters and coupling agents for highly filled compounds. Ready-to-use, easy to dose liquid products and tailor-made blends consisting of all necessary ingredients for grafting and crosslinking of polyethene resulting in crosslinked polyethylene (PEX/XLPE).

Ancamine, Ancamide, Amicure, Curezol, Dicyanex and Imicure enable adhesive bonding of different substrates providing higher strength and flexibility. For one component systems (1K) and two component systems (2K) we offer polyamides, amidoamines, curing agents, accelerators, diluents, dicyandiamide (DICY) and more.

Coatings with P84® polyimide solutions are characterized by high dielectric strength at very thin layer thicknesses.

VESTANAT® contains aliphatic and cycloaliphatic diisocyanate monomers for light stable PU resins and elastomers, waterborne polyurethane dispersions as well as cycloaliphatic polyisocyanates for durable polyurethane coatings.

May it be building blocks for resin synthesis, hardeners for 2K coatings or blocked systems for 1K applications we have the right solution for can coatings, artificial leather, OEM clear coats as well as wood coatings and plastic coatings. We offer IPDI, H12MDI, TMDI, T1890 and more.

Intermediates from help manufacturers of electronic products to develop new solutions for their needs - such as DRIVOSOL® as a natural refrigerant in refrigerators, or our materials for the rubber and plastics market that can be used in equipment parts.

From polymer electronical performance, to flame resistance and heat transfer, our portfolio meets all the demands of these cable and electronics applications.

VESTAMID® polyamide, VESTAKEEP® PEEK and VESTODUR® PBT used in sheathing or in cable protection tubing have protected cables for years. Continuous improvements let them always be the material of choice for the electronics and cable industry.

Our polymers for the electronics industry can be used for cable insulation such as cable filling compounds and jelly compounds.

We offer tailor-made polyesters, amorphous poly-alpha-olefins and liquid polybutadienes for potting compounds for electronics and cable insulation. Our range of products also covers polyester-based adhesives for electronics such as flexible flat cables.

Are you looking for a material for dielectric applications that combines the RF transparency of air with unrivalled processing performance at up to 190 °C (374 °F) and superior mechanical properties? Look no further: ROHACELL® rigid foam is doing the trick!

Silica serves as antiblocking agents in the polymerization process or as additives for rheology control in circuit board production.

Silica effectively act as a chemistry binder in the phosphor layer of fluorescent lamps and prevent mercury pollution. Thus, the service life of fluorescent lamps is extended. In LED lamps, our silica is used as diffusion particles in LED silicon lenses.

Ultrahigh purity hexachlorodisilane used in the semiconductor industry for chemical vapor deposition (CVD) of silicon-containing films on silicon wafers at very low temperatures. Ultrahigh purity hexachlorodisilane is mainly used in the manufacture of next generation memory chips with the highest storage densities.

Siridion® ultrahigh purity silicon tetrachloride is the key feedstock in optical fiber production. It is also used in the manufacture of polycrystalline silicon for the semiconductor and photovoltaics industries, and in the production of synthetic fused quartz glass.

Small electronic devices require narrower semiconductor fabrication. They need to occupy smaller spaces and perform better. But this leads to a critical challenge in processing: damage from electrostatic discharges (ESDs). Use our VESTAKEEP ® PEEK portfolio for ESD shielding.